Initiatives to firmly link the real space (physical space) where people live and the virtual space (cyberspace) inside computers to address social problems and create new businesses have been proposed as Society 5.0 and cyber-physical systems, and are attracting attention. To create a wide range of display devices and sensors embedded in real space, it is necessary to reduce the size and thickness of devices, and also to support 3D shapes such as ergonomic designs. Existing products with electronic circuits built into 3D curved surfaces, such as automotive panels, game controllers, and computer mice, are manufactured by attaching parts and wiring to resin that has been shaped into 3D structures. However, the challenge of forming wiring and circuits on 3D structures limits improvements in production speed and cost reduction. Technology to shape circuits manufactured in a flat shape into three dimensions would be an effective means of addressing this issue, but it has not been realized due to circuit damage that occurs during 3D shaping. Therefore, a new technology that enables high-speed shaping into three dimensions without a loss of electronic circuit functions has been demanded.

The researcher has developed a method that enables easy high-speed 3D shaping without damage to electronic circuits fabricated on a flat resin sheet.

The developed thermo-projection shaping method is a technology that enables to perform the 3D circuit fabricating and resin shaping processes at the same time, which enables 3D shaping without damaging the electronic circuits formed on a flat resin sheet. The heat applied to the sheet during shaping is partially blocked to create non-deforming areas, thus avoiding damage to mounted semiconductor chips and deformation of wiring in those areas. As the 3D circuit fabricating and resin shaping processes can be performed simultaneously, the developed technology is effective in improving the mass productivity of 3D electronic circuits and manufacturing panel products with embedded circuits, and application to a wide range of fields can be expected.